Manufacturing installation of semiconductor

Abstract

PURPOSE: To provide the manufacturing installation, of a semiconductor, wherein a restriction on a building and a site is reduced, the number of inspection devices and persons required for an inspection operation can be reduced and it is easy to comply with a change in a process. CONSTITUTION: A plurality of in-process conveyance lines 1 to 5 are arranged in parallel; cassette stockers 6 to 10 are arranged at ends, on one side, of the individual in-process conveyance lines; an in-process conveyance line 13 which conveys a wafer cassette among the cassette stockers is arrange; and in-process main conveyance devices 19 are installed in the individual in-process conveyance lines. In addition, intermediate cassette stockers 11 and 12 are arranged, and in-process subconveyance devices 29 and 30 are installed. In addition, testing rooms 31 and 32 are installed, inspection devices 33 to 34 are arranged, and a prescribed inspection is executed. COPYRIGHT: (C)1992,JPO&Japio

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Cited By (4)

    Publication numberPublication dateAssigneeTitle
    JP-2014107396-AJune 09, 2014Denso Corp, 株式会社デンソー搬送システム
    US-7308757-B2December 18, 2007Seiko Epson CorporationIntermediate product manufacturing apparatus, and intermediate product manufacturing method
    US-8206076-B2June 26, 2012Tokyo Electron LimitedSubstrate processing system
    US-9177844-B2November 03, 2015Denso CorporationTransport system