Ic socket

Abstract

PURPOSE: To avoid the occurrence of a lead bend and a lead scratch while enhancing the high-frequency characteristics during the IC measurement, by inserting the IC. CONSTITUTION: In the title IC socket structure wherein the package of an IC 5 to be measured is to be aligned by a housing 2 and a contactor 1, the contact position of the contactor 1 with the lead 6 of the IC 5 is set up to be the position between the package and the first bending point of the lead 6. Through these procedures, the load on the lead 6 can be decreased by the contact in the position close to the package causing neither lead bend nor a scratch on the lead surface since the lead is not inserted into the contactor 1. On the other hand, the high-frequency characteristics can be enhanced by the contact with the lead 6 in the position close to the integrated circuit. COPYRIGHT: (C)1992,JPO&Japio

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