High-frequency hybrid integrated circuit device

Abstract

PURPOSE: To obtain a high-frequency hybrid integrated circuit device which can be soldered to an external circuit board together with other parts by one soldering process even when misalignment of a cap occurs or the dimensional accuracy of the cap is bad by providing a plurality of positioning projections protruding toward the protruding direction of leads from the lead-side side edge of a radiating fin. CONSTITUTION: This high-frequency hybrid integrated circuit device is provided with an integrated circuit board 2 from which leads 3 for connecting the substrate 2 to an external circuit are protruded, radiating fin 1 which is fitted to a chassis adjacent to the substrate 2 and provided with fitting notches 1a, and cap 4 which covers the substrate 2. In such integrated circuit device, a plurality of positioning projections 1b which are protruded toward the protruding direction of the leads 3 from the side edge of the fin 1 is provided on the fin 1. The dimension between the front ends of the projections 1b and the center of the notches 1a is made equal to the distance between the surface of the external substrate provided on the chassis and center of fitting tapped holes formed through the chassis. COPYRIGHT: (C)1992,JPO&Japio

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